El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!
—— Peter Goolsby
Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase
—— Antonello Sau
Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!
Soft Thermal Gap Filler / Thermal Interface Heat Transfer Material TIF150-30-12U for LED light Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Leer más
3mmT*200*400mm size 6.2W/mK thermal gap filler from China factory The TIF6120G thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ... Leer más
LED Power Supply Thermal Phase Changing Materials Heat sink Thermal Sheet The TIC™810Y Series is low melting point thermal interface material. At 50℃, The TIC™810Y Series begins to soften and flow, filling the ... Leer más
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins to soften and flow, filling ... Leer más
Low Melting Materials Customized High Quality Phase Change Material For Notebook TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the ... Leer más
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, ... Leer más
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, ... Leer más
No Need Preheating Pink Thermal Phase Change Interface Material For Notebook The TIC™808P Series is low melting point thermal interface material. At 50℃, The TIC™808P Series begins to soften and flow, filling ... Leer más
Gray -25℃ - 125℃ Thermal Interface Material Phase Change for High Power LED Lights TIC™805G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the ... Leer más
Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, ... Leer más