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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Certificación
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Comentarios de cliente
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Ampliación de imagen :  Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF100-60-11U
Documento: TIF100-60-11U_Data Sheet.pdf
Pago y Envío Términos:
Cantidad de orden mínima: 1000 Uds.
Precio: Negociable
Detalles de empaquetado: 1000PCS/BOLSA
Tiempo de entrega: 3-5 días de trabajo
Condiciones de pago: T/T
Capacidad de la fuente: 10000/día

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

descripción
Nombre de los productos: Cojín termal del silicón termal del relleno de huecos con 6.0W/mK conductor termal para la transfere Conductividad y composión térmica: 6,0 W/m-K
Peso específico: 3,4 g/cm³ Construcción: Elastómero de silicona relleno de cerámica
Color: Gris oscuro Temperatura de uso continuo: -40 a 200℃
Dureza: 65/27 Orilla 00 Palabras clave: Almohadilla térmica de silicona
Solicitud: Para transferencia de calor en electrónica automotriz

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics


Products description


The TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:


> Good thermal conductive: 6.0 W/mK

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Memory Modules 
>  Mass storage devices 
>  Automotive electronics 
>  Set top boxes 
>  Audio and video components 

 
Typical Properties of TIF®100-60-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007
 
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics 0

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

 

Company Profile

 

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

 

Certifications:


 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  


Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: +86 18153789196

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