Brief: Discover the TIC800P, a RoHS recognized low melting phase change material designed for laptop computers. With a thermal conductivity of 1.5W/mK, it ensures efficient heat dissipation. Ideal for power conversion equipment, LED lighting, and more, this high-performance material offers low thermal resistance and self-adhesive properties.
Related Product Features:
RoHS recognized low melting phase change material for efficient heat dissipation.
Thermal conductivity of 1.5W/mK ensures optimal performance.
Self-adhesive properties eliminate the need for additional surface adhesives.
Low-pressure application environment for easy installation.
Suitable for power conversion equipment, LED lighting, and laptop computers.
Available in standard thicknesses of 0.005 inch (0.125mm) and 0.006 inch (0.150mm).
Can be die-cut into different shapes for customized applications.
Operating temperature range of -40℃ to 150℃ for versatile use.
Las preguntas:
What is the thermal conductivity of the TIC800P material?
The TIC800P material has a thermal conductivity of 1.5W/mK, ensuring efficient heat dissipation.
Is the TIC800P material self-adhesive?
Yes, the TIC800P material is self-adhesive, eliminating the need for additional surface adhesives.
What are the standard thicknesses available for the TIC800P material?
The TIC800P material is available in standard thicknesses of 0.005 inch (0.125mm) and 0.006 inch (0.150mm).