El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!
—— Peter Goolsby
Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase
—— Antonello Sau
Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!
—— Chris Rogers
Estoy en línea para chatear ahora
40 shore a heat absorbing material fabricación en línea
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Leer más
-40 to 160℃ low cost insulation silicone pad for LED Ceilinglamp,20 Shore 00 The TIF180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature ... Leer más
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Leer más
Thermal conductive gap pad for semiconductor automated test equipment (ATE),20±5 Shore 00,3.0 W/m-K The TIF1120-30-11US is recommended for applications that require a minimum amount of pressure on components. ... Leer más
4.5mmT,20±5 Shore 00 Good performance thermal conductive pad for Automotive engine control units, The TIF1180-30-11US is recommended for applications that require a minimum amount of pressure on components. The ... Leer más
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Leer más
soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on ... Leer más
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The ... Leer más
Two Component Thermally Conductive Wave Absorbing Gel For Battery Management System In New Energy Vehicles Company Profile Dongguan Ziitek Electronic Material and Technology Co., Ltd. is a professional ... Leer más
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Leer más