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High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

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High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Ampliación de imagen :  High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF500-30-11US
Pago y Envío Términos:
Cantidad de orden mínima: 1000 Uds.
Precio: Negociable
Detalles de empaquetado: 1000PCS/BOLSA
Tiempo de entrega: 3-5 días de trabajo
Capacidad de la fuente: 10000/día
Descripción detallada del producto
Nombre del producto: Almohadilla térmica de silicona de alto rendimiento con gran conductividad y aislamiento para proces Aplicación: CPU GPU AI y procesadores
Palabras clave: Almohadilla térmica Conductividad térmica: 3.0W/m-K
Color: Gris oscuro Rango de espesor: 0,25~5,0 mm (0,010~0,20 pulgadas)
Construcción y composición: Elastómero de silicona relleno de cerámica Dureza: 65 orilla 00

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors


Company Profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
 

Products description


TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> RoHS compliant
> UL recognized


Applications:

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Heat pipe thermal solutions
> Memory Modules
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply

Typical Properties of TIF®500-30-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

 

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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