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Datos del producto:
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| Nombre de productos: | Gel conductor térmico blanco, relleno de huecos suave a base de silicona de alta conductividad térmi | Densidad: | 3.2 g/cm3 |
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| Color: | Gris | Temperadora operativa recomendada: | -40-200℃ |
| Conductividad térmica: | 4.0W/mK | Palabras clave: | Gel conductor térmico |
| Composición: | Material de silicona de relleno cerámico | Solicitud: | Equipo de laboratorio automático de semiconductores |
| Resaltar: | white thermal conductive gel,silicone based gap filler,high thermal conductivity gel |
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White Thermal Conductive Gel Silicone Based Soft High Thermal Conductivity Gap Filler TIF® 040-06 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is
Persona de Contacto: Dana Dai
Teléfono: +86 18153789196