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Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

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Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad
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Datos del producto:
Lugar de origen: China.
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: Se aplicarán las siguientes medidas:
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: Negociable
Detalles de empaquetado: 1000 piezas por bolsa
Tiempo de entrega: 3 a 5 días hábiles
Capacidad de la fuente: 10 000/día
Descripción detallada del producto
Nombre del producto: Pad de separación térmica autoadhesivo de 0,3 mm a 5,0 mm de espesor 6,0 W/M·K Pad térmico de silico Dureza: 50 orilla 00
El color: Es gris. Conductivity& termal Compostion: 6.0W/m-K
Gravedad específica: 3.3 g/cc El grosor: 0.012" (~ 0,30 mm) ~ 0,200" (~ 5,00 mm)
Construcción: Elastómero de silicona relleno de cerámica Los Continuos utilizan a temporeros: -45 °C a 200 °C
Aplicación: Procesador portátil Heatsink CPU GPU SSD El refrigerador LED IC Palabras clave: cojines termales del silicón
Resaltar:

0.3mm Pad de separación térmica

,

6.0W/M·K Pad de separación térmica

,

5.0 mm Pad de separación térmica

Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

 

TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 5.0W/mK

> Self-adhesive without the need for additional surface adhesive
> Naturally tacky needing no further adhesive coating
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications:

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of  TS-TIF®100C 6050-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 50 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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