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8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

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—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

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Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

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8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

Ampliación de imagen :  8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

Datos del producto:
Place of Origin: China
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Model Number: TIF760R Series
Pago y Envío Términos:
Minimum Order Quantity: 1000pcs
Precio: Negociable
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Descripción detallada del producto
Products name: 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard Keywords: Thermal Gap Filler Pad
Hardness: 30±10 Shore 00 Color: Gray
Thermal conductivity& Compostion: 8.5W/m-K Specific Gravity: 3.55g/cc
Thickness: 1.5mmT Construction: Ceramic filled silicone elastomer
Continuos Use Temp: -45℃ to 200℃ Application: CPU GPU PC Motherboard

8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

 

TIFTM740R thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:
> Excellent thermal conductivity 8.5W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Applications:

> Cooling components to the chassis of frame

> Set Top Box
> Car Battery & Power Supply

> Charging Pile
> LED TV/ Lighting
> Graphics Card Thermal Module

Typical Properties of  TIF740R Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.55g/cm3 ASTM D297
Thickness 1.5mmT ASTM D374
Hardness 30±10 Shore 00 ASTM 2240
Operating Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >4000 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94-V0 equivalent UL
Thermal conductivity 5.5W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Thicknesses:

Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Independent R&D team

 

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Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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