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Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

Estoy en línea para chatear ahora

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Ampliación de imagen :  Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF600P
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: Negociable
Detalles de empaquetado: 1000pcs/bolsa
Tiempo de entrega: 3-5 días
Capacidad de la fuente: 100000pcs/día
Descripción detallada del producto
Nombre del producto: Almohadilla de relleno de espacios de conductividad térmica ultra alta para servidores AI Palabras clave: cojín termal del reemisor de isofrecuencia
Dureza: 60 orilla00 Constante dieléctrica @1MHz: 4.5
Muestra: Muestra libre Color: granate
Conductividad térmica: 6,0 W/m-K Densidad (g/cm³): 3.4
Aplicación: Servidores de IA

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
 
Features:

> High thermal conductivity: 6.0W/mK

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> Broad range of hardnesses available

> Outstanding thermal performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Signal communication
>  New energy vehicle
>  Motherboard chip
>  Radiator

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

> SMD LED module
> LED Flesible strip, LED bar
> Routers
> Medical Devices

Typical Properties of TIF®600P Series
Property Value Test method
Color Garnet Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >4.2X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470

6.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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