El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!
—— Peter Goolsby
Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase
—— Antonello Sau
Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!
Consumer Electronics Thermal Conductive Adhesive Tape 0.8W/MK Glass Fiber Backing Heat Resistant Tape The TIA®815 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal ... Leer más
Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe TIF®030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent ... Leer más
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Leer más
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Leer más
Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components ... Leer más
High Performance 1.6W/mK Aluminum Foil Double Sided Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other power ... Leer más
Outgasing 0.35% UL recognized Conductive Pads for Micro Heat Pipe Thermal Solutions The TIF1160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Leer más
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Leer más
IGBTs Thermal Conductive Pad Designed For Filling Air Gaps Between Heating Elements And Metal Bases To Improve Heat Dissipation Product introduction The TIF® 100-20-18S Series thermally conductive interface ... Leer más