El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!
—— Peter Goolsby
Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase
—— Antonello Sau
Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!
High Performance Acrylic Adhesive Heat-Conducting Double-Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductor... Leer más
High Temperature Heat Resistant Acrylic Adhesive Double Sided Thermal Conductive Tape for LED Light Heat dissipation tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, ... Leer más
The TIA™810FG Acrylic Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Leer más
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Leer más
Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA™805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconduct... Leer más
2.0W /mK thermal gap filler pad 3mmT Ziitek TIF4120 for Heat Sinking Housing at LED-lit BLU in LCD Company ProfileZiitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal ... Leer más
Excellent Flexibility Thermal Conductive High Heat Plastic Housings for LED Lamps Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Leer más
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Leer más
Gray Heat Dissipation Fins Thermal Gap Filler For notebook, -40 - 160℃ Continuos Use Temp 3.0 W/m-K The TIF120-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... Leer más
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad The TIF110FG-14E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Leer más