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7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

Estoy en línea para chatear ahora

7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling

7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling

Ampliación de imagen :  7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF500-75-11U
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: Negociable
Detalles de empaquetado: 1000PCS/BOLSA
Tiempo de entrega: 3-5 días laborables
Condiciones de pago: T/T
Capacidad de la fuente: 100000 unidades/día
Descripción detallada del producto
Nombre de los productos: Fácil y seguro instalar el cojín de enfriamiento del silicón de los cojines térmicos 7.5W/MK con aut Dureza: 50/27 Orilla 00
Solicitud: ordenador portátil de la PC Conductividad térmica: 7.5W/m-K
Color: Gris oscuro temporeros del uso continuo: -40 a 200℃
Muestra: Muestra libre Espesor: 0,020"(0,50 mm)~0,200"(5,0 mm)
Palabras clave: Pad de enfriamiento de silicona
Resaltar:

self-adhesive silicone thermal pad

,

7.5W/M.K laptop cooling pad

,

PC thermal gap filler

Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

 

The TIF®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


> High thermal conductivity
> Super soft and highly compliant
> Good insulation performance

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Industrial Control
> New Energy

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Al Servers
> Semiconductor Packaging
> Low-altitude Aircraft
> Optical Communication Products
> 5G Base Stations

 

Typical Properties of TIF®500-75-11U Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.00~5.00)
Hardness 50 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 8.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 7.5 ASTM D5470
7.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness: 0.020" (0.50 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

7.5W/m-K Ultra-Soft Self-Adhesive Thermal Pad for PC Laptop Cooling 1

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: +86 18153789196

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