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Datos del producto:
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| Nombre: | Gel conductor termal bicomponente 3.0W/mK para disipador de calor y semiconductor generador de calor | Color: | Azul |
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| Palabra clave: | Gel conductor térmico | Aplicaciones: | Disipador de calor y semiconductor generador de calor |
| Resistencia a la rotura (V/mm): | ≥5500 | Densidad: | 3.1 g/cm3 |
| Conductividad térmica: | 3.0W/mK | Construcción: | Materiales cerámicos llenos de silicio |
| Resaltar: | 3.0W/mK thermal conductive gel,heat sink thermal gel,semiconductor thermal conductive gel |
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Two Component 3.0W/mK Thermal Conductive Gel For Heat Sink And Heat Generating Semiconductor TIF® 030AB-05R is a two-component liquid gap filler material, featuring high thermal conductivity, low thermal resistance, excellent electrical insulation, and high temperature aging resistance. After curing, its performance is equivalent to that of thermal conductive silicone rubber sheets, making it suitable for low stress and high compression modulus scenarios. The cured adhesive
Persona de Contacto: Dana Dai
Teléfono: +86 18153789196