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1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

Estoy en línea para chatear ahora

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

Ampliación de imagen :  1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

Datos del producto:
Lugar de origen: PORCELANA
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF100-02S
Pago y Envío Términos:
Cantidad de orden mínima: 1000pcs
Precio: Negociable
Detalles de empaquetado: 1000pcs/bolsa
Tiempo de entrega: 3-5 días de trabajo
Capacidad de la fuente: 100000pcs/día
Descripción detallada del producto
Nombre de los productos: 1.5W 0.5 ~ 5.0 mm de espesor Aislante de aislamiento Aislante Materiales elementos Almohadilla condu Palabras clave: Cojín conductor termal
Dureza: 45 costa 00 Espesor: 0.020" ((0.5mm) ~ 0.200" ((5.0mm)
Conductividad térmica: 1,5 W/m-K temporeros del uso continuo: -45 a 200 °C
Color: Gris Solicitud: Módulo térmico de tarjeta gráfica

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

 

The TIF®100-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF®100-02S Series
Property Value Test method
Color Gray ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(0.50mm) ASTM D374
Specific Gravity 2.3g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0 X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

 

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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