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High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
El cojín conductor termal es de mirada y de trabajo de muy bueno. ¡Ahora no tenemos ninguna necesidad del otro cojín conductor termal!

—— Peter Goolsby

Había cooperado con Ziitek durante 2 años, proporcionaron los materiales conductores termales de alta calidad, y la entrega a tiempo, recomienda sus materiales del cambio de fase

—— Antonello Sau

Buena calidad, buen servicio. ¡Su equipo siempre nos da ayuda y la resolución, esperanza que seremos buen socio todo el tiempo!

—— Chris Rogers

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High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Ampliación de imagen :  High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF100-40-11U
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: Negociable
Detalles de empaquetado: 1000PCS/BOLSA
Tiempo de entrega: 3-5 días de trabajo
Condiciones de pago: T/T
Capacidad de la fuente: 10000/día
Descripción detallada del producto
Nombre del producto: Relleno de almohadilla térmica a base de silicona de alto rendimiento para procesadores de IA Servid Temperatura de uso continuo: -40 a 200℃
Voltaje de descomposición dieléctrica: El valor de las emisiones de CO2 será igual o superior a: Constante dieléctrica: 7,0 megaciclos
Color: Gris oscuro Peso específico: 3.2 g/cc
Palabras clave: Relleno de almohadilla de separación térmica Conductividad térmica: 4.0W/mK
Solicitud: Procesadores de IA Servidores de IA

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

The TIF®100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:


> Good thermal conductive: 4.0W/mK 

> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®100-40-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
4.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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