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Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
Porcelana Dongguan Ziitek Electronic Materials & Technology Ltd. certificaciones
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Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Ampliación de imagen :  Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: ZIITEK
Certificación: UL and RoHs
Número de modelo: TIF100 3030-06
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: Negociable
Detalles de empaquetado: 1000PCS/BOLSA
Tiempo de entrega: 3-5 días laborables
Condiciones de pago: T/T
Capacidad de la fuente: 100000 unidades/día
Descripción detallada del producto
Nombre del producto: Conductividad térmica de la almohadilla térmica ultrasuave de 3,0 W/Mk para AIoT de IA aeroespacial Clasificación de llama: UL 94V-0
Dureza: 30 orilla 00 Aplicación: 5G IA aeroespacial AIoT y automoción
Conductividad térmica: 3.0W/m-K Temperatura de uso continuo: -40 a 200℃
Peso específico: 3,0 g/cc Palabras clave: Almohadilla Térmica Ultra Suave

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive

 

The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

 

Company Profile

 

A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying properties to suit every application.


Features


> Good thermal conductive: 3.0W/mK 
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications

 

Electronic Components,5G,Aerospace,AI, AIoT, AR/VR/MR/XR, Automotive,
Consumer Devices,Datacom,Electric Vehicle,Electronic Products,Energy
Storage,Industrial, Lighting Equipment,Medical, Military,Netcom,Panel, Power
Electronics,Robot,Servers,Smart Home,Telecom,etc.

 

Typical Properties of The TIF®100 3030-06 Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 30 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.8 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: 18153789196

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